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IEEE transactions on components, packaging, and manufacturing technology

NLM Title Abbreviation:
IEEE Trans Compon Packaging Manuf Technol
Title(s):
IEEE transactions on components, packaging, and manufacturing technology.
Uniform Title:
IEEE transactions on components, packaging, and manufacturing technology 
Merged From:
IEEE transactions on advanced packaging ISSN 1521-3323
IEEE transactions on components and packaging technologies ISSN 1521-3331
IEEE transactions on electronics packaging manufacturing ISSN 1521-334X
Publication Start Year:
2011
Frequency:
Bimonthly
Country of Publication:
United States
Publisher:
Piscataway, NJ : IEEE
Language:
English
ISSN:
2156-3950 (Print)
2156-3985 (Electronic)
LCCN:
2010204545
Electronic Links:
Access not provided by NLM
In:
PubMed: Selected citations only
Current Indexing Status:
Not currently indexed for MEDLINE. Citations are for articles where the manuscript was deposited in PubMed Central (PMC) in compliance with public access policies. For further information, see Author Manuscripts in PMC.
Notes:
Also issued online.
Merger of: IEEE transactions on advanced packaging, IEEE transactions on components and packaging technologies, and IEEE transactions on electronics packaging manufacturing.
Other ID:
(OCoLC)646185968
Collection Status:
Not in the NLM Collection
NLM ID:
101568904 [Serial]

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