Digital Speckle Pattern Interferometry (DSPI), originally known as electronic speckle pattern interferometry (ESPI), is an interferometry based method applicable for conducting 3-dimensional whole field strain characterization. The present DSPI systems are suited for analyzing a relatively simple surface (e.g., a plane surface). However, few existing systems are able to accurately determine strain distributions on a surface with significant contour complexity. Here, we present development of a novel DSPI system that allows strain characterization of a sample with a complex surface. In the described DSPI system, deformations and contours as well as an absolute phase value are determined. Furthermore, variations in measurement sensitivity are considered. We describe a principle and methodology using two examples in the area of mechanical engineering and biomedical engineering, and discuss potential usages and future directions.