Superior thermal interface materials for thermal management

Feng, CP; Bai, L; Bao, RY; Wang, SW; Liu, ZY; Yang, MB; Chen, J; Yang, W

Yang, W (reprint author), Sichuan Univ, Coll Polymer Sci & Engn, State Key Lab Polymer Mat Engn Chengdu, Chengdu 610065, Sichuan, Peoples R China.

COMPOSITES COMMUNICATIONS, 2019; 12 (): 80

Abstract

Thermal interface materials (TIMs) have been widely used in various electronic devices and are crucial for next generation electronics such as flexibl......

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