High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders

Chang, CW; Lin, KL

Chang, CW (reprint author), Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan.

JOURNAL OF ELECTRONIC MATERIALS, 2019; 48 (1): 135

Abstract

The effect of a minor addition of Ti on the mechanical behavior of Zn-25Sn-xTi (x=0wt.%, 0.02wt.% and 0.04wt.%) solder alloy at high temperatures of 8......

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