Understanding the Barrier Layer Formed via Adding BTAH in Copper Film Electrodeposition

Chang, TR; Leygraf, C; Wallinder, IO; Jin, Y

Jin, Y (reprint author), Univ Sci & Technol Beijing, Natl Ctr Mat Serv Safety, Beijing 100083, Peoples R China.

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2019; 166 (2): D10

Abstract

The influence of surface adsorption of benzotriazole (BTAH) and of chloride ions (Cl-) on the kinetics of copper electrodeposition/dissolution in copp......

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