Panel Warpage of Fan-Out Panel-Level Packaging Using RDL-First Technology

Che, FX; Yamamoto, K; Rao, VS; Sekhar, VN

Che, FX (corresponding author), Agcy Sci Technol & Res A STAR Res Ent, Inst Microelect, Singapore 138634, Singapore.

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020; 10 (2): 304

Abstract

In this study, fan-out panel-level packaging (FO-PLP) technology using a redistribution layer (RDL) first approach is demonstrated using a large glass......

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