Predicting reliability behavior in HBM packages through numerical simulation

Sangkun, O; Hong, J; Lee, S; Kyung, S; Lee, J; Kim, K; Park, J; Oh, D

Sangkun, O (通讯作者)，Samsung Elect Co Ltd, Hwaseong Si, South Korea.

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023; (): 689

Abstract

A typical HBM (High Bandwidth Memory) package consists of multiple memory dies in a stack formation. A passivation material may be inserted between th......

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