Layer-by-layer etching of LaAlSiOx

Omura, M; Furumoto, K; Matsuda, K; Sasaki, T; Sakai, I; Hayashi, H

Omura, M (reprint author), Toshiba Co Ltd, Ctr Semicond Res & Dev, Yokaichi, Mie 5128550, Japan.

PLASMA SOURCES SCIENCE & TECHNOLOGY, 2017; 26 (6):

Abstract

Layer-by-layer etching of LaAlSiOx using surface modification and selective removal steps was investigated. Selective removal of the LaAlSiOx layer mo......

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