Probability prediction model for bridging defects induced by combined influences from lithography and etch variations

Su, XJ; Shen, D; Wei, YY; Fan, TA; Dong, LS; Zhang, LB; Su, YJ; Chen, R; Ye, TC

Wei, YY; Su, YJ (reprint author), Chinese Acad Sci, Inst Microelect, Beijing, Peoples R China.; Wei, YY (reprint author), Univ Chinese Acad Sci, Beijing, Peoples R China.

JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2019; 18 (2):

Abstract

Background: As semiconductor technologies continue to shrink, the growth in the number of process variables and combined effects tighten the overall p......

Full Text Link