Diffusion Barrier Behaviors of V-Ta, V-Ta-N and V-Ta/V-Ta-N Alloy Films in Cu Interconnects

Lu, Y; Xiao, YX; Dai, T; Wang, CP; Yang, SY; Liu, XJ

Wang, CP (corresponding author), Xiamen Univ, Coll Mat & Fujian Prov, Key Lab Mat Genome, Xiamen, Peoples R China.

JOURNAL OF ELECTRONIC MATERIALS, 2020; 49 (7): 4231

Abstract

The V-Ta, V-Ta-N and V-Ta/V-Ta-N alloy barrier layers with thickness of 50 nm were deposited on Si (100) substrates by magnetron sputtering and then t......

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