期刊： SOLDERING & SURFACE MOUNT TECHNOLOGY, ; ()
Purpose The purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and......
期刊： SOLDERING & SURFACE MOUNT TECHNOLOGY, ; ()
Purpose Low-Ag SAC solder will lead to a series of problems, such as increased the melting range and declined the solderability and so on. These resea......
期刊： SOLDERING & SURFACE MOUNT TECHNOLOGY, ; ()
Purpose This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times. Design/metho......
期刊： SOLDERING & SURFACE MOUNT TECHNOLOGY, 2021; 33 (2)
Purpose The impact strength of solder joint under high strain rate was evaluated by board level test method. However, the impact shear test of single ......
期刊： SOLDERING & SURFACE MOUNT TECHNOLOGY, 2020; 32 (3)
Purpose Viscosity is an important basic physical property of liquid solders. However, because of the very complex nonlinear relationship between the v......
期刊： SOLDERING & SURFACE MOUNT TECHNOLOGY, 2020; 32 (1)
Purpose The transistor circuit based on Moore's Law is approaching the performance limit. The three-dimensional integrated circuit (3-D IC) is an impo......
期刊： SOLDERING & SURFACE MOUNT TECHNOLOGY, 2019; 31 (1)
Purpose The purpose of this study is to develop a monolayer surface coating of stearic acid on Sn-Ag-Cu solder powder to limit oxidation. Design/metho......
期刊： SOLDERING & SURFACE MOUNT TECHNOLOGY, 2019; 31 (1)
Purpose The purpose of this paper is to investigate the diffusion behaviors of different atoms at the Cu/Cu3Sn interface and the vacancy formation ene......
期刊： SOLDERING & SURFACE MOUNT TECHNOLOGY, 2019; 31 (1)
Purpose Crack and stress distribution on dies are key issues for the pressure-assisted sintering bonding of power modules. The purpose of this researc......
期刊： SOLDERING & SURFACE MOUNT TECHNOLOGY, 2019; 31 (1)
Purpose This study aims to analyze the shear strength and fracture mechanism of full Cu-Sn IMCs joints with different Cu3Sn proportion and joints with......
期刊： SOLDERING & SURFACE MOUNT TECHNOLOGY, 2019; 31 (1)
Purpose To explore substitutes for traditional Sn-Pb solder, Sn-20In-2.8Ag was considered because of its appropriate melting temperature, good reliabi......
期刊： SOLDERING & SURFACE MOUNT TECHNOLOGY, 2019; 31 (2)
Purpose With continuous concerning on the toxic of element Pb, Pb-free solder was gradually used to replace traditional Sn-Pb solder. However, during ......
期刊： SOLDERING & SURFACE MOUNT TECHNOLOGY, 2019; 31 (4)
Purpose The purpose of this paper is to investigate the effect of nickel-plated graphene (Ni-GNS) on the microstructure and mechanical properties of 9......
期刊： SOLDERING & SURFACE MOUNT TECHNOLOGY, 2019; 31 (4)
Purpose The purpose of this paper is to study the variation of the mechanical strength and failure modes of solder balls with reducing diameters under......
期刊： SOLDERING & SURFACE MOUNT TECHNOLOGY, 2019; 31 (4)
Purpose Stencil cleaning is an important operation in solder paste printing process. Frequent cleaning may interrupt printing process and increase idl......
