Integrated circuit (IC)-embedded wafer-level packaging technology for millimeter-wave power ICs

Yook, JM; Sim, S; Park, BJ; Kim, D; Kim, YJ

Kim, YJ (reprint author), Gachon Univ, Dept Elect Engn, 1342 Seongnam Daero, Seongnam Si 13120, Gyeonggi Do, South Korea.

MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2019; 61 (9): 2210

Abstract

A wafer-level packaging (WLP) technology for millimeterwave power devices is presented, which features simple fabrication, low-signal transition loss,......

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