Optimal Channel Design for Die-to-Die Interface in Multi-die Integration Applications

Park, J; Nam, S; Moon, S; Kim, J

Park, J (通讯作者)，Samsung Elect Co Ltd, Foundry Business, 1-1 Samsungjeonja Ro, Hwaseong Si 18448, Gyeonggi Do, South Korea.

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023; (): 1509

Abstract

To support technical trend of multi-die integration in HPC platform, various die-to-die interface IPs have been introduced for seamless connection bet......

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