A Non-Slicing 3-D Floorplan Representation for Monolithic 3-D IC Design

Das, S; Kim, DH

Das, S (reprint author), Washington State Univ, Sch Elect Engn & Comp Sci, Pullman, WA 99164 USA.

PROCEEDINGS OF THE 2019 20TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED), 2019; (): 323

Abstract

In this paper, we propose a non-slicing 3-D floorplan representation to design block-level monolithic 3-D ICs. The new 3-D floorplan representation ap......

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