Distortion Simulation for Direct Wafer-to-Wafer Bonding Process

Ip, N; Nejadsadeghi, N; Kohama, N; Tanoue, H; Motoda, K

Ip, N (通讯作者),Tokyo Elect Amer Inc, Austin, TX 78741 USA.

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023; (): 694

Abstract

Direct wafer bonding technology is used in a growing number of semiconductor applications to meet device scaling challenges. Tight bonded wafer distor......

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