An In-Circuit Test Method for Measuring the Bonding Resistances of Individual IC Pins From an Interconnected Multiple IC Assembly of Flexible Hybrid Electronics

Khan, RA; Yousaf, S; Roberts, GW

Khan, RA (通讯作者),McGill Univ, Dept Elect & Comp Engn, Integrated Microsyst Lab, Montreal, PQ H3A 0E9, Canada.

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2023; 70 (3): 939

Abstract

An in-circuit test method for extracting the series parasitic resistance associated with the bonding material used to attach IC chips to Flexible Hybr......

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