Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures

Zhai, XM; Chen, Y; Li, YF; Zou, J; Shi, MM; Yang, BB; Li, Y; Guo, CF; Hu, RR; Bao, QJ

Li, YF; Zou, J (corresponding author), Shanghai Inst Technol, Coll Sci, Shanghai 201418, Peoples R China.

JOURNAL OF ELECTRONIC MATERIALS, 2021; 50 (10): 5965

Abstract

In the actual production process, soldering is a key step in the flip-chip packaging process. The reliability of the interconnection interface of flip......

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