Adhesion Mechanism between Mold Resin and Sputtered Stainless Steel Ground Films for Electromagnetic Wave Shield Packages

Homma, S; Takano, Y; Watanabe, T; Murakami, K; Fukuda, M; Imoto, T; Nishikawa, H

Homma, S (通讯作者)，Kioxia Corp, Memory Packaging Dev Dept, Yokaichi 5128550, Japan.;Homma, S (通讯作者)，Osaka Univ, Grad Sch Engn, Suita, Osaka 5650871, Japan.

MATERIALS TRANSACTIONS, 2022; 63 (6): 766

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