Analysis of Material, Design & LER of Advanced BEOL Metal Lines Using Process Modeling

Yim, D; Vincent, B

Yim, D (通讯作者)，Lam Res GK, Kyoto, Japan.

2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAM, 2023; ():

Abstract

We study interconnect metallization options in advanced logic BEOL. Our goal is to choose interconnect materials and process integration options that ......

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