Pulsed Current Plating Does Not Improve Microscale Current Distribution Uniformity Compared to Direct Current Plating at Equivalent Time-Averaged Plating Rates

Maraschky, A; Akolkar, R

Maraschky, A (corresponding author), Case Western Reserve Univ, Dept Chem & Biomol Engn, Cleveland, OH 44106 USA.

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2021; 168 (6):

Abstract

Suppression of surface roughness and dendrite growth under pulsed current (p.c.) plating is a widely reported effect for a variety of electrodeposited......

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