Warpage Analysis of Fan-Out Panel-Level Packaging Using Equivalent CTE

Tsai, CH; Liu, SW; Chiang, KN

Chiang, KN (corresponding author), Natl Tsing Hua Univ, Dept Power Mech Engn, Hsinchu 300, Taiwan.

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2020; 20 (1): 51

Abstract

In this study, we developed a simple method to obtain the equivalent coefficient of thermal expansion (CTE) by comparing the results of the finite ele......

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