The Evolution of Microstructure and Resistance in Electroplated Copper Films by Linear Integrated Laser Scanning Annealing

Tan, LY; Han, SL; Chen, SH; Hang, T; Ling, HQ; Wu, YW; Li, M

Wu, YW; Li, M (corresponding author), Shanghai Jiao Tong Univ, State Key Lab Met Matrix Composites, Key Lab Thin Film & Microfabricat Technol, Minist Educ, Shanghai 200240, Peoples R China.

ELECTRONIC MATERIALS LETTERS, 2021; 17 (2): 207

Abstract

Thermal treatment is an effective way to decrease the resistivity and internal stress by inducing grain growth accompanied with redistribution of embe......

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