Determination of T-stress for thermal cracks in homogeneous and functionally graded materials with the numerical manifold method

Zhang, HH; Ji, XL; Han, SY; Fan, LF

Han, SY (corresponding author), Nanchang Hangkong Univ, Sch Civil Engn & Architecture, Nanchang 330063, Jiangxi, Peoples R China.

THEORETICAL AND APPLIED FRACTURE MECHANICS, 2021; 113 ():

Abstract

T-stress plays an important role in the fracture of various materials, and is frequently adopted as a second fracture parameter in addition to the str......

Full Text Link