Solder Void Criteria of BTC Component Investigation

Chiu, CC; Li, HF

Chiu, CC (reprint author), Univ Global Sci Ind Co LTD, 141,Lane 351,Taiping Rd,Sec 1, Nantou 54261, Taiwan.

2017 12TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2017; ( ): 331

Abstract

There are no criteria for Bottom Terminal Component (BTC) solder void except 30% area for EGA solder joints in IPC-A-610F. It means supplier and custo......

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