Shrunk-2-D: A Physical Design Methodology to Build Commercial-Quality Monolithic 3-D ICs

Panth, S; Samadi, K; Du, Y; Lim, SK

Panth, S (reprint author), Intel Corp, San Jose, CA 95134 USA.

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2017; 36 (10): 1716

Abstract

Monolithic 3-D (M3D) integrated circuits (ICs) are an emerging technology that offer much higher integration densities than previous 3-D IC approaches......

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