Cu-Cu Wiring: The Novel Structure of Cu-Cu Hybrid Bonding

Kagawa, Y; Kamibayashi, T; Fujii, N; Furuse, S; Yamada, T; Hirano, T; Iwamoto, H

Kagawa, Y (通讯作者)，Sony Semicond Solut Corp, Atsugi, Kanagawa, Japan.

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023; (): 103

Abstract

We have developed the novel structure of Cu-Cu hybrid bonding called Cu-Cu wiring. The Cu-Cu wirings have been formed through hybrid bonding of Cu lin......

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