Line-to-Line TDDB Modeling: LER Specs for Sub-20-nm Pitch Interconnects

Fang, Y; Ciofi, I; Roussel, PJ; Lesniewska, A; Degraeve, R; De Wolf, I; Croes, K

Fang, Y (通讯作者),IMEC, Adv Reliabil Robustness & Test, B-3001 Leuven, Belgium.

IEEE TRANSACTIONS ON ELECTRON DEVICES, 2023; 70 (8): 4332