Abstract
Lee, H; Tombak, GI; Park, G; Kuchenbecker, KJ
Kuchenbecker, KJ (通讯作者),Max Planck Inst Intelligent Syst, Hapt Intelligence Dept, D-70569 Stuttgart, Germany.;Park, G (通讯作者),Gwangju Inst Sci & Technol GIST, AI Grad Sch, Gwangju 61005, South Korea.
IEEE TRANSACTIONS ON HAPTICS, 2022; 15 (3): 521