Temporary Bonding and Debonding Study with the Newly Developed Room Temperature Mechanical Debonding Material

Masuda, S; Yamauchi, A; Iwai, Y; Sawano, M; Okabe, K; Shimada, K

Masuda, S (reprint author), FUJIFILIM Corp, Kawashiri 4000,Yoshida Cho, Shizuoka 4210396, Japan.

JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, 2019; 32 (2): 203

Abstract

The wafer thinning process and making backside redistribution layer (RDL) process were key technologies for assembling 2.5D and 3D IC the low profile ......

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