Identifying the microstructural features associated with void nucleation during elevated-temperature deformation of copper-MedSci.cn

Identifying the microstructural features associated with void nucleation during elevated-temperature deformation of copper

Noell, PJ; Deka, N; Sills, RB; Boyce, BL

Noell, PJ (通讯作者)，Sandia Natl Labs, POB 5800, Albuquerque, NM 87185 USA.

FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES, 2022; 45 (7): 1882

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