Microstructure evolution and thermal, wetting, mechanical properties of SiC nanowires reinforced SAC105 composite solder

Lu, X; Zhang, L; Guo, YH; Wang, X; Li, ML; Chen, C; Gao, LL; Zhao, M

Zhang, L; Guo, YH (通讯作者),Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Peoples R China.;Zhang, L (通讯作者),Xiamen Univ Technol, Sch Mat Sci & Engn, Xiamen 361000, Peoples R China.

INTERMETALLICS, 2023; 154 ():