Overview of several applications of Chemical Downstream Etching CDE for IC manufacturing. Advantages and drawbacks versus WET processes

de Buttet, C; Prevost, E; Campo, A; Garnier, P; Zoll, S; Vallier, L; Cunge, G; Maury, P; Massin, T; Chhun, S

de Buttet, C (reprint author), CEA, LETI, MINATEC Campus,17 Rue Martyrs, F-38054 Grenoble 9, France.; de Buttet, C (reprint author), STMicroelectronics, 850 Rue Jean Monnet, F-38926 Crolles, France.

ADVANCED ETCH TECHNOLOGY FOR NANOPATTERNING VI, 2017; 10149 ( ):

Abstract

Today the IC manufacturing faces lots of problematics linked to the continuous down scaling of printed structures. Some of those issues are related to......

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