A Module-Level Spring-Interconnected Stack Power Module

Dutta, A; Ang, SS

Dutta, A (reprint author), Univ Arkansas, Dept Elect Engn, Fayetteville, AR 72701 USA.; Dutta, A (reprint author), Wolfspeed, Fayetteville, AR 72701 USA.

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019; 9 (1): 88

Abstract

This paper presents the design, fabrication, and characterization of a module-level spring-interconnected stack power module for power semiconductor d......

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