Growth behavior of tin whisker and hillock on Cu/Ni/SnAg micro-bumps under high temperature and humidity storage

Lin, K; Wang, J; Yang, CL; Sun, ML; Hu, AM; Wu, YW; Ling, HQ; Li, M

Hu, AM (corresponding author), Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, State Key Lab Met Matrix Composites,Minist Educ, Key Lab Thin Film & Microfabricat Technol, Shanghai 200240, Peoples R China.

MATERIALS LETTERS-X, 2021; 9 ():

Abstract

It is the first time that tin whisker was observed to grow from shallow surface grains on Cu/Ni/SnAg micro-bumps under high temperature and humidity s......

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