A Silicon Metamaterial Chip-to-Chip Coupler for Photonic Flip-Chip Applications

Barwicz, T; Kamlapurkar, S; Martin, Y; Bruce, RL; Engelmann, S

Barwicz, T (reprint author), IBM Corp, TJ Watson Res Ctr, 1101 Kitchawan Rd, Yorktown Hts, NY 10598 USA.

2017 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC), 2017; ( ):

Abstract

We demonstrate a metamaterial converter with a highly elongated coupler mode optimized for direct optical chip-to-chip connections. We show a highly b......

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