Substituting Bond Wires by Additively Manufactured Interconnections

Lomakin, K; Sippel, M; Gold, G; Ringel, J; Weiss, D; Helmreich, K; Ankenbrand, M; Franke, J

Lomakin, K (reprint author), Friedrich Alexander Univ Erlangen Nuremberg, Inst Microwaves & Photon, Erlangen, Germany.

2018 11TH GERMAN MICROWAVE CONFERENCE (GEMIC 2018), 2018; (): 367

Abstract

This work shows a comparison of microstrip to integrated circuits junction between conventional bond wires and additively manufactured signal intercon......

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