Ultrathin High-Q 2-D and 3-D RF Inductors in Glass Packages

Kim, MS; Pulugurtha, MR; Sundaram, V; Tummala, RR; Yun, HB

Kim, MS (reprint author), Georgia Inst Technol, Syst Packaging Res Ctr 3 D, Atlanta, GA 30332 USA.

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018; 8 (4): 643

Abstract

Embedded inductors in ultrathin glass substrates were modeled, designed, fabricated, and characterized. Various 2-D and 3-D topologies were explored t......

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