Low temperature interfacial reaction in 3D IC nanoscale materials

Liu, YX; Lu, Y; Tu, KN

Tu, KN (通讯作者)，City Univ Hong Kong, Dept Adv Design & Syst Engn, Kowloon, Hong Kong, Peoples R China.

MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2022; 151 ():

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