Numerical Design and Laboratory Testing of Encapsulated PCM Panels for PCM-Air Heat Exchangers

Santos, T; Wrobel, LC; Hopper, N; Kolokotroni, M

Kolokotroni, M (corresponding author), Brunel Univ London, Dept Mech & Aerosp Engn, Kingston Lane, Uxbridge UB8 3PH, Middx, England.

APPLIED SCIENCES-BASEL, 2021; 11 (2):

Abstract

Heat transfer between encapsulated PCM panels and air plays an important role in PCM-Air heat exchangers. A new design for the encapsulation panel was......

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