Characterization Of Silicon Die Strength With Different Die Backside Unevenness Location

Chia, LC; Huat, LB; Wan, CM; Robiatun, MSS; Man, JLS

Chia, LC (reprint author), Infineon Technol Adv Log, Sdn Bhd FTZ Batu Berendam, Melaka 75350, Malaysia.

2018 IEEE 38TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT), 2018; ():

Abstract

Development of mircoelectronic packages are always moving towards smaller and thinner. This is in conjunction of consumers need for mobile and wearabl......

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