Advanced Interconnects for Chiplets

Abdilla, J

Abdilla, J (通讯作者)，Besi Netherlands BV, Hybrid Bonding, Duiven, Netherlands.

2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC, 2023; ():

Abstract

Full Text Link


Links

期刊讨论 | 中国SCI论文 | 期刊主页 | 投稿经验 | 杂志官网 | 投稿链接 | 作者需知 | PMC链接 | Pubmed全文检索