Inductive links for 3D stacked chip-to-chip communication

Sun, X; Pantano, N; Kim, SW; Van der Plas, G; Beyne, E

Sun, X (reprint author), IMEC, Kapeldreef 75, Leuven, Belgium.

2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019; (): 1215

Abstract

This paper focusses on an experimental inductive link study based on S-parameter measurements up to 67 GHz for 3D stacked chip to chip communication. ......

Full Text Link


Links

期刊讨论 | 中国SCI论文 | 期刊主页 | 投稿经验 | 杂志官网 | 投稿链接 | 作者需知 | PMC链接 | Pubmed全文检索