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MICROELECTRONICS JOURNAL

出版年份:暂无数据 年文章数:1951 投稿命中率: 开通期刊会员,数据随心看

出版周期:Monthly 自引率:10.5% 审稿周期: 开通期刊会员,数据随心看

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投稿信息

投稿信息
审稿费用
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版面费用
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中国人发表比例
2023年中国人文章占该期刊总数量暂无数据 (2022年为100.00%)
自引率
10.5 %
年文章数
1951
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作者需知
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偏重的研究方向
期刊简介
稿件收录要求
Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on semiconductor technology. Coverage of the journal falls into the two main categories of Circuits and Systems and Physics and Devices. The journal invites research and application papers in all the areas listed below. Papers featuring novel system designs or devices are especially welcomed. The journal also considers comprehensive review/survey papers covering recent developments. The journal's coverage includes, but is not limited to: Circuits and Systems Analogue, digital and RF circuit design methodologies Logic, architectural and system level synthesis Testing, design for testability, built in self-test Area, power and thermal evaluation Co-design, including hardware-software and chip-package Mixed-domain simulation and design Formal verification Application aspects such as signal and image processing, sensor and actuator design, reliability and quality issues, and economic models, are also welcome. Physics and Devices Materials growth science: technology and techniques Physics, properties and characterisation of materials systems Devices and microsystems technology: production and manufacturing Advanced lithography for submicron devices and VLSI microlithography Nanoelectronics and nanoprecision instrumentation Technology and applications of magnetic materials Molecular engineering: molecular materials and self-assembly processes Devices covered include semiconductor devices, optoelectronic devices, micromachined devices, nanodevices and hybrid devices. Papers covering the associated materials, physics, properties, fabrication and manufacturing of these devices are also welcomed. Journal homepages: www.elsevier.nl/locate/mejo www.elsevier.com/locate/mejo www.elsevier.co.jp/locate/mejo