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Projection-based high coverage fast layout decomposing algorithm of metal layer for accelerating lithography friendly design at full chip level

期刊: JOURNAL OF MICRO-NANOPATTERNING MATERIALS AND METROLOGY-JM3, 2021; 20 (1)

Background: As semiconductor technologies continue to shrink, optical proximity correction may not have enough space to optimize layout due to limitat......

Improved MEMS piezoelectric vibratory stage with reduced off-axis error

期刊: JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2020; 19 (1)

Background: The piezoelectric microvibratory stage as a microelectromechanical system (MEMS) actuator can tilt around the X/Y axis and translate along......

Thermoplastic polyurethane-based flexible multilayer microfluidic devices

期刊: JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2020; 19 (2)

Background: Microfluidics has been widely used in the biological and medical fields, and polymers are the most widely used materials in microfluidics ......

Gradient-based source mask and polarization optimization with the hybrid Hopkins-Abbe model

期刊: JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2020; 19 (3)

Source mask and polarization optimization (SMPO) is a promising extension of the widely used resolution enhancement technology, source mask optimizati......

Construction of complex logic circuit based on nanoparticles

期刊: JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2020; 19 (3)

Background: Molecular logic circuits have great potential applications. DNA logic circuit is an important research direction of DNA computing in nanot......

Predictor of thermal aberrations via particle filter for online compensation

期刊: JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2019; 18 (1)

In optical lithography, aberrations induced by lens heating effects of a projection lens lead to degradation of imaging quality. In order to compensat......

JIF:1.19

Improved HNA isotropic etching for large-scale highly symmetric toroidal silicon molds with < 10-nm roughness

期刊: JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2019; 18 (4)

Microsystem technology is well suited to batch fabricate microhemispherical resonator gyroscopes (HRG) to reduce cost and volume. In the processing of......

JIF:1.19

SoulNet: ultrafast optical source optimization utilizing generative neural networks for advanced lithography

期刊: JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2019; 18 (4)

An optimized source has the ability to improve the process window during lithography in semiconductor manufacturing. Source optimization is always a k......

JIF:1.19

Deep silicon etching for thermopile structures using a modified Bosch process

期刊: JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2019; 18 (2)

We present a simple method of deep anisotropic etching of silicon up to 400 mu m with nearly vertical sidewall profile for thermopile devices. The met......

JIF:1.19

Probability prediction model for bridging defects induced by combined influences from lithography and etch variations

期刊: JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2019; 18 (2)

Background: As semiconductor technologies continue to shrink, the growth in the number of process variables and combined effects tighten the overall p......

JIF:1.19

Contact inspection and resistance-capacitance measurement of Si nanowire with SEM voltage contrast

期刊: JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2019; 18 (2)

A methodology to evaluate the electrical contact between nanowire (NW) and source/drain in NW FETs was investigated with SEM voltage contrast (VC). Th......

JIF:1.19

Review of scanning electron microscope-based overlay measurement beyond 3-nm node device

期刊: JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2019; 18 (2)

Overlay control has been one of the most critical issues for manufacturing of leading edge semiconductor devices. Introduction of the double patternin......

JIF:1.19

Influence of e-beam aperture angle on critical dimensions-scanning electron microscopes measurements for high aspect ratio structure

期刊: JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2019; 18 (2)

The influence of the e-beam aperture angle on the critical dimensions (CD)-scanning electron microscope measurements for a high aspect ratio (AR) stru......

JIF:1.19

Potential use of laser-induced breakdown spectroscopy combined laser cleaning for inspection of particle defect components on silicon wafer

期刊: JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2019; 18 (3)

The contamination control of silicon wafer surface is more and more strict. Many investigations have been done to inspect defects on silicon wafer. Ho......

JIF:1.19

CD metrology for EUV resist using high-voltage CD-SEM: shrinkage, image sharpness, repeatability, and line edge roughness

期刊: JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2019; 18 (3)

Background: Extreme ultraviolet (EUV) lithography was introduced for the high-volume manufacturing of stateof-the-art semiconductor devices in 2019. O......

JIF:1.19

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