Solid-state cooling: thermoelectrics

Qin, YX; Qin, BC; Wang, DY; Chang, C; Zhao, LD

Qin, BC; Zhao, LD (通讯作者),Beihang Univ, Sch Mat Sci & Engn, Beijing 100191, Peoples R China.;Zhao, LD (通讯作者),Key Lab Intelligent Sensing Mat & Chip Integrat T, Hangzhou 310051, Peoples R China.

ENERGY & ENVIRONMENTAL SCIENCE, 2022; 15 (11): 4527

Abstract

The growing demand of thermal management in various fields such as miniaturized 5G chips has motivated researchers to develop new and high-performance......

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