Die to Wafer/Die DBI Hybrid Bonding for a True 3D Interconnect

Haba, B

Haba, B (reprint author), XPERI Corp, 3025 Orchard Pkwy, San Jose, CA 95134 USA.

PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2019; (): 18