Wafer-to-Wafer Bonding Fabrication Process-Induced Wafer Warpage

Feng, W; Shimamoto, H; Kawagoe, T; Honma, I; Yamasaki, M; Okutsu, F; Masuda, T; Kikuchi, K

Feng, W (通讯作者),Natl Inst Adv Ind Sci & Technol, Device Technol Res Inst, 3D Integrat Syst Grp, Tsukuba 3058560, Japan.

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2023; 36 (3): 398

Abstract

Wafer warpage affects the resolution of photolithography, process alignment, and wafer bonding, which leads to the degradation of the device's yield, ......

Full Text Link